UK Trademark Search > TrueBump

TrueBump United Kingdom Trademark Information

Design and development of methods for determining and assessing characteristics of 3D structures, such as bumps, pillars, pads, balls and vias on substrates, such as semiconductor wafers, semiconductor die, integrated circuits in whatever form, including position, height, dimensions, and co-planarity.Inspection equipment and devices for inspecting and characterizing substrates such as semiconductor wafers, semiconductor die, integrated circuits in whatever form, including in packages, printed circuit boards, liquid crystal displays electronic displays, memory storage media.

Words that describe this mark

design   development   methods   determining   assessing   characteristics   3d   structures     bumps     pillars     pads     balls   vias   substrates     semiconductor   wafers     semiconductor   die     integrated   circuits   form     including   position     height     dimensions     coplanarityinspection  
On Friday, January 26, 2018, a united kingdom trademark registration was filed for TrueBump by Onto Innovation Inc. ********, ********, ***** ****. The United Kingdom IP office has given the trademark application number of UK00917743923. The current status of this trademark filing is Registered. The correspondent listed for TrueBump is ERNEST GUTMANN - YVES PLASSERAUD S.A.S. of ********, ********, ***** **** The TrueBump trademark is filed in the category of Computer & Software Services & Scientific Services , Computer & Software Products & Electrical & Scientific Products .
Word Mark: TrueBump
Current Status:
Registered
LIVE (Circa: 2018)
Application Number: UK00917743923
Filing Date: Friday, January 26, 2018
Registration Date: Thursday, August 9, 2018
Type of Mark: Individual
Mark Feature: Word
Publication: Not Available
Last Applicant/Owner: ********
********
***** ****
Correspondent:
********
********
***** ****

Classification Information

Class Description: 042 - Computer & Software Services & Scientific Services
Goods & Services: Design and development of methods for determining and assessing characteristics of 3D structures, such as bumps, pillars, pads, balls and vias on substrates, such as semiconductor wafers, semiconductor die, integrated circuits in whatever form, including position, height, dimensions, and co-planarity.
Class Description: 009 - Computer & Software Products & Electrical & Scientific Products
Goods & Services: Inspection equipment and devices for inspecting and characterizing substrates such as semiconductor wafers, semiconductor die, integrated circuits in whatever form, including in packages, printed circuit boards, liquid crystal displays electronic displays, memory storage media.
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