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TANTELITE
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TANTELITE United Kingdom Trademark Information

Sputtering targets, namely tantalum sputtering targets; metal sputtering targets for use in the semiconductor industry; metal sputtering targets for use in vacuum sputter deposition of inorganic coatings on substrates; metallic and other inorganic material sputtering targets for use in vacuum coating of metallic and inorganic material on substrates such as semiconductor wafers.

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Words that describe this mark

sputtering   targets     tantalum   sputtering   targets   metal   sputtering   targets   use   semiconductor   industry   metal   sputtering   targets   use   vacuum   sputter   deposition   inorganic   coatings   substrates   metallic   inorganic   material   sputtering   targets   use   vacuum   coating   metallic   inorganic   material   substrates   semiconductor   wafers  
On Thursday, July 27, 2023, a united kingdom trademark registration was filed for TANTELITE by Materion Corporation ********, ********, ***** ****. The United Kingdom IP office has given the trademark application number of UK00003939346. The current status of this trademark filing is Registered. The correspondent listed for TANTELITE is ip21 Limited of ********, ********, ***** **** The TANTELITE trademark is filed in the category of Metal Products .
Word Mark: TANTELITE
Current Status:
Registered
LIVE (Circa: 2023)
Application Number: UK00003939346
Filing Date: Thursday, July 27, 2023
Registration Date: Friday, November 17, 2023
Type of Mark: Individual
Mark Feature: Word
Publication:
2023/036: Friday, September 8, 2023
Last Applicant/Owner: ********
********
***** ****
Correspondent:
********
********
***** ****

Classification Information

Class Description: 006 - Metal Products
Goods & Services: Sputtering targets, namely tantalum sputtering targets; metal sputtering targets for use in the semiconductor industry; metal sputtering targets for use in vacuum sputter deposition of inorganic coatings on substrates; metallic and other inorganic material sputtering targets for use in vacuum coating of metallic and inorganic material on substrates such as semiconductor wafers.
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