RETICLE United Kingdom Trademark Information

Designing, engineering, and customizing physical and chemical vapor deposition systems for others.Physical and chemical vapor deposition systems, namely, machines used for sputter deposition, electron beam evaporation, thermal evaporation, ion beam deposition, ion beam sputter deposition, ion assisted deposition, pulsed laser deposition, atomic layer deposition; .

Words that describe this mark

designing     engineering     customizing   physical   chemical   vapor   deposition   systems   othersphysical   chemical   vapor   deposition   systems       machines   used   sputter   deposition     electron   beam   evaporation     thermal   evaporation     ion   beam   deposition     ion   beam   sputter   deposition  
On Sunday, May 23, 2021, a united kingdom trademark registration was filed for RETICLE by Angstrom Engineering Inc. ********, ********, ***** ****. The United Kingdom IP office has given the trademark application number of UK00003646200. The current status of this trademark filing is Registered. The correspondent listed for RETICLE is Harrison IP Limited of ********, ********, ***** **** The RETICLE trademark is filed in the category of Computer & Software Services & Scientific Services , Machinery Products .
Word Mark: RETICLE
Current Status:
Registered
LIVE (Circa: 2021)
Application Number: UK00003646200
Filing Date: Sunday, May 23, 2021
Registration Date: Friday, January 28, 2022
Type of Mark: Individual
Mark Feature: Word
Publication:
2021/047: Friday, November 19, 2021
Last Applicant/Owner: ********
********
***** ****
Correspondent:
********
********
***** ****

Classification Information

Class Description: 042 - Computer & Software Services & Scientific Services
Goods & Services: Designing, engineering, and customizing physical and chemical vapor deposition systems for others.
Class Description: 007 - Machinery Products
Goods & Services: Physical and chemical vapor deposition systems, namely, machines used for sputter deposition, electron beam evaporation, thermal evaporation, ion beam deposition, ion beam sputter deposition, ion assisted deposition, pulsed laser deposition, atomic layer deposition; .
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