on 26 Feb 2019
Last Applicant/ Owned by
Higashi-ku, Hamamatsu-shi
Shizuoka
JP
435-8558
Serial Number
86598182 filed on 15th Apr 2015
Registration Number
5686410 registered on 26th Feb 2019
Filing Basis
1. intent to use
2. use application currently
Disclaimer
"DICING"
"DICING" Treatment of materials, namely, dicing semiconductor wafers; treatment of materials by laser beam
Treatment of materials, namely, dicing semiconductor wafers; treatment of materials by laser beam
31st Aug 2016
31st Aug 2016
No 86598182
No Service Mark
No FT15-0071-00
No
No
No
No
No
No
No
No
| Status Date | Action Taken |
|---|---|
| 26th Feb 2024 | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED |
| 26th Feb 2019 | REGISTERED-PRINCIPAL REGISTER |
| 19th Jan 2019 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |
| 18th Jan 2019 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
| 27th Dec 2018 | STATEMENT OF USE PROCESSING COMPLETE |
| 19th Dec 2018 | TEAS STATEMENT OF USE RECEIVED |
| 19th Dec 2018 | USE AMENDMENT FILED |
| 09th Jun 2018 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| 08th Jun 2018 | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
| 08th Jun 2018 | SOU EXTENSION 5 GRANTED |
