on 18 Sep 2018
Last Applicant/ Owned by
Parc Technologique des Fontaines,
FR
Serial Number
79204687 filed on 30th Nov 2016
Registration Number
5563066 registered on 18th Sep 2018
Correspondent Address
Molly MackCrandall
Filing Basis
1. filing basis filed as 66 a
Disclaimer
NO DATA
Scientific, technological, technical and industrial research in the field of material science for micro-electronics, opto-electronics, piezo electronics and micro-engineering, photovoltaics, microsystems and radio frequency (RF) components provided by engineers; testing of materials; laboratory work for others, namely, materials testing and scientific research and development; research and developRead More
Scientific, technological, technical and industrial research in the field of material science for micro-electronics, opto-electronics, piezo electronics and micro-engineering, photovoltaics, microsystems and radio frequency (RF) components provided by engineers; testing of materials; laboratory work for others, namely, materials testing and scientific research and development; research and development of new products for others; scientific research and development in the field of wafers and semiconductors for opto-electronic and piezo electronics components, photovoltaics, radio frequency (RF) components, power components, micro-engineering, and micro-systems; scientific research and development in the field of silicon wafers and semiconductors for integrated circuits and derived activities; scientific research and development in the field of the transfer of micro-electronic circuits or micro-systems on all media; engineering and engineering services in the field of semiconductor wafers and semiconductors for micro-electronic, opto-electronic, piezo-electronic radio frequency (RF), micro-mechanical, photovoltaic components, memories, power components; engineering and engineering services in the field of silicon wafers and semiconductors for integrated circuits and derived activities and the transfer of micro-electronic or opto-electronic circuits or micro-systems on all types of media; research for the development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, memories, diodes, photodiodes, light-emitting diodes, photodiode detectors, radio frequency (RF) components and micro-systems; assistance and technical support, namely, technical advice in the field of development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, diodes, photodiodes, light-emitting diodes, photodiode detectors, radio frequency (RF) components and micro-systems
Treatment of materials by means of annealing, thermal annealing, rapid thermal annealing, laser annealing, oxidation, implantation for layer exfoliation, grinding, chemical and physical layer deposition in the nature of electrophoretic coating services, epitaxy, and bonding of material for layer transfer; Treatment of substrates by means of glass substrate polishing, grinding, chemical treatment of surface to remove particles and/or contaminants, laser irradiation, plasma treatment in the nature of applying plasma finishes, amorphization, re-crystallization, etching, chemical etching, plasma etching, carbonization, smoothing by means of plasma, heat treatment, plasma activation to hydrophilize surfaces, and hydrophilization for micro-electronics, opto-electronics, piezoelectric, photovoltaics, microsystems and radio frequency (RF) components; treatment of semiconductor wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of semiconductor wafers, transfer of layer by exfoliation; treatment of silicon wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of silicon wafers and semiconductors, transfer of layer by exfoliation
Semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, semiconductor chips, integrated circuits, transistors, capacitors, filters for radiofrequency bandwidth selection, oscillators, electric switches, electric resistors, amplifiers, and electronic memories; semi-conductor wafers; semi-conductors; silicon wafers and semiconductors for integrated circuits and derived activities; semiconductor wafers for light-emitting diodes, radio frequency (RF) components and for power components; substrates for micro-electronics, opto-electronics, micro-engineering, light-emitting diodes, micro-systems, photovoltaics, integrated optical guides, sensors, integrated circuits, radio frequency (RF) and power components, namely, semiconductor chips, integrated circuits, transistors, capacitors, cable connectors, filters for radiofrequency bandwidth selection, oscillators, electric switches, electric resistors, amplifiers, and electronic memories
No 79204687
No Service Mark
No GKS0222TUS
No
No
No
No
Yes
Yes
No
No
26.03.14 -
Three or more ovals
26.03.21 -
Ovals that are completely or partially shaded
26.11.21 -
Rectangles that are completely or partially shaded
27.03.01 -
Geometric figures forming letters or numerals, including punctuation
The mark consists of the stylized word "SOITEC" appearing in black font with the "O" formed by three ovals with pointed ends. The ovals are blue, green, and black. The color grey represents background and is not a feature of the mark.
| Status Date | Action Taken |
|---|---|
| 16th Jan 2024 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| 16th Jan 2024 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| 16th Jan 2024 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| 18th Sep 2023 | COURTESY REMINDER - SEC. 71 (6-YR) E-MAILED |
| 17th Jan 2019 | FINAL DECISION TRANSACTION PROCESSED BY IB |
| 29th Dec 2018 | FINAL DISPOSITION PROCESSED |
| 29th Dec 2018 | FINAL DISPOSITION NOTICE SENT TO IB |
| 18th Dec 2018 | FINAL DISPOSITION NOTICE CREATED, TO BE SENT TO IB |
| 06th Dec 2018 | NEW REPRESENTATIVE AT IB RECEIVED |
| 18th Sep 2018 | REGISTERED-PRINCIPAL REGISTER |
