accepted and acknowledged
on 10 Oct 2020
Last Applicant/ Owned by
5 Kamichoshi-cho, Kamitoba, Minami-ku
Kyoto-shi, Kyoto
JP
601-8105
Serial Number
86006708 filed on 10th Jul 2013
Registration Number
4661819 registered on 30th Dec 2014
Correspondent Address
Jerald E. Nagae, Reg. No. 29,418
Filing Basis
1. intent to use
Disclaimer
NO DATA
PANEL MOLD Machines for encapsulation of semiconductor chips mounted on substrates with resin material
Machines for encapsulation of semiconductor chips mounted on substrates with resin material
No 86006708
No Service/Collective Mark
No FUPO-2-52757
Yes
No
No
Yes
No
No
No
No
Status Date | Action Taken |
---|---|
30th Dec 2023 | COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED |
10th Oct 2020 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
10th Oct 2020 | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. |
10th Oct 2020 | NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED |
28th Aug 2020 | TEAS SECTION 8 & 15 RECEIVED |
30th Dec 2019 | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED |
30th Dec 2014 | REGISTERED-PRINCIPAL REGISTER |
18th Sep 2014 | 1(B) BASIS DELETED; PROCEED TO REGISTRATION |
17th Sep 2014 | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
11th Sep 2014 | TEAS DELETE 1(B) BASIS RECEIVED |