on 12 Mar 2024
Last Applicant/ Owned by
Arche Bat 7 - Savoie Technolac,
FR
Serial Number
79358894 filed on 27th Sep 2022
Registration Number
N/A
Correspondent Address
Mari-Elise Paul
Filing Basis
1. filing basis filed as 66 a
Disclaimer
NO DATA
Testing of machining techniques, namely, technical tests and trials for conducting cuts, meplats, bevels; testing and tests of surface preparation techniques, namely, technical testing and testing of lapping, precision grinding, mechanical and chemical mechanical polishing (CMP), cleaning, laser marking; technical tests of other surface treatments for others in the field of materials used to for Read More
Testing of machining techniques, namely, technical tests and trials for conducting cuts, meplats, bevels; testing and tests of surface preparation techniques, namely, technical testing and testing of lapping, precision grinding, mechanical and chemical mechanical polishing (CMP), cleaning, laser marking; technical tests of other surface treatments for others in the field of materials used to for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; research and development for new products for others; research and development of new consumable products for others used in machining operations, namely, operations for conducting cuts, meplats, bevels; research and development of new consumable products for others for use in surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; research and development of new consumables for others used in other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; technical advice for conducting machining operations, namely, operations for conducting cuts, meplats, bevels; technical advice for conducting surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; technical advice for conducting other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; technical advice for surface characterization, namely, topography, roughness and chemical analysis; technical advice for structure characterization, namely, morphology and crystallography; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding
mechanical treatment of wafers of semiconductor or piezoelectric materials or oxides relating to machining operations, namely, processing for conducting cuts, meplats, bevels; mechanical, chemical and optical treatment of wafers of semiconductor or piezoelectric materials or oxides relating to for surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; other mechanical, chemical and physical surface treatments, , used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; surface characterization process being, physical, chemical and optical, namely, topography, roughness and chemical analysis; structure characterization method being chemical or physical, namely, morphology and crystal structure; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling
Single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different machining operations, namely, operations for conducting cuts, meplats, bevels; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface preparation operations ready for epitaxy or bonding, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components; all these goods being used in precision grinding, mechanical and chemical mechanical polishing (CMP) operations and other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling
No 79358894
No Service Mark
No
No
No
No
No
Yes
Yes
No
No
| Status Date | Action Taken |
|---|---|
| 11th Apr 2024 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| 11th Apr 2024 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| 11th Apr 2024 | TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS |
| 11th Apr 2024 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| 12th Mar 2024 | PUBLISHED FOR OPPOSITION |
| 12th Mar 2024 | NOTIFICATION PROCESSED BY IB |
| 12th Mar 2024 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| 21st Feb 2024 | NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB |
| 21st Feb 2024 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| 21st Feb 2024 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
