non
on 11 Jan 2024
Last Applicant/ Owned by
1-1-2 Yurakucho, Chiyoda-ku
Tokyo
JP
100-0006
Serial Number
88867983 filed on 10th Apr 2020
Registration Number
N/A
Correspondent Address
Michael T. Smith
Filing Basis
1. intent to use
2. intent to use current
Disclaimer
NO DATA
Adhesive substances for use in the electronics industry; Synthetic epoxy resin adhesive for use in the electronics industry; Chemical preparations for use in coating in the electronics industry; Chemical coating agents used in the manufacture of electronic components; Unprocessed epoxy resin used in the further manufacture of coating agents for use in the electronics industry; Unprocessed epoxy reRead More
Paints and varnishes for use in the electronics industry; Coatings in the nature of industrial sealants for waterproofing and surface hardening for use in the electronics industry; Sealer coatings for use in the field of semiconductors and electronic components; Epoxy resin sealer coatings for use in the manufacture of electrical insulating materials; Epoxy resin-based coatings for use on metals, motor cores and copper wires in the electronics industry; Epoxy resin-based coatings for use on metals, copper wires and motor cores in the electronic industry; none of the foregoing for use in the foundry industry
19th Apr 2023
20th Sep 2023
Adhesive substances for use in the electronics industry; Synthetic epoxy resin adhesive for use in the electronics industry; Chemical preparations for use in coating in the electronics industry; Chemical coating agents used in the manufacture of electronic components; Unprocessed epoxy resin used in the further manufacture of coating agents for use in the electronics industry; Unprocessed epoxy resin-containing chemical agents for use as raw materials in the manufacture of industrial products, namely, adhesive, coating agents, sealants, paints, varnishes, and conductive pastes used in the electronics industry; Curing agents for synthetic resin for use in the electronics industry; Curing agents for synthetic epoxy resin, for use in the electronics industry; Amine compounds-containing curing agents for synthetic resin for use in the electronics industry; none of the foregoing for use in the foundry industry
19th Apr 2023
20th Sep 2023
No 88867983
No Service/Collective Mark
No 0071-0929US1
No
No
No
No
No
No
No
No
| Status Date | Action Taken |
|---|---|
| 07th Mar 2024 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| 11th Jan 2024 | SU - NON-FINAL ACTION - WRITTEN |
| 11th Jan 2024 | NON-FINAL ACTION E-MAILED |
| 11th Jan 2024 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| 20th Nov 2023 | ASSIGNED TO EXAMINER |
| 15th Nov 2023 | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
| 15th Nov 2023 | STATEMENT OF USE PROCESSING COMPLETE |
| 01st Nov 2023 | TEAS STATEMENT OF USE RECEIVED |
| 01st Nov 2023 | USE AMENDMENT FILED |
| 16th May 2023 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
