express
on 28 Apr 2022
Last Applicant/ Owned by
No. 6, Technology Road 5
Hsinchu
TW
30078
Serial Number
97169878 filed on 13th Dec 2021
Registration Number
N/A
Correspondent Address
PAULO A. DE ALMEIDA
Filing Basis
1. intent to use
2. intent to use current
Disclaimer
NO DATA
Computer software in the field of collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition, and VR (Virtual Reality), AR (Augmented Reality) and MR(Mixed Reality); Electronic hardware and softRead More
Computer software in the field of collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition, and VR (Virtual Reality), AR (Augmented Reality) and MR(Mixed Reality); Electronic hardware and software for use in collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Electronic security apparatus and surveillance apparatus; Software and electronic hardware utilizing eye and gesture tracking technology; Algorithm software programs for collision avoidance, object detection, object recognition, object tracking, volume measurement, SLAM (Simultaneous Localization And Mapping) and SLAM tracking, eye and gesture tracking and control, human pose detection and tracking, hand tracking, face recognition; Semiconductor chip sets for use in enabling image signal processing; Integrated circuits and integrated circuit cores for use in image signal processing; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Chipsets; Semiconductor chip sets; Microchips (computer hardware); Silicon chips; Semiconductor chips; Multiprocessor chips; Computer chips; integrated circuits (IC); micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer hardware; computer components; computer circuits; Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Electric and electronic circuits; Wafers for integrated circuits; Integrated circuit cards and components; Semiconductors; Semiconductor devices; Semiconductor wafers; Chips, chip sets, and modules for 3D sensing, 3D sensor fusion and 3D perception. For clarity purpose, 3D sensing means to collect information in 3D dimension, and 3D perception means to make certain decision and reaction in accordance with such collected information; Plates, glass slides or chips having multi-well arrays that can be used in chemical analysis, biological analysis or patterning for scientific, laboratory or medical research use; Semiconductor chip sets for use in enabling memory, multiway communications and processing capabilities; KGDM; known good die; known good die memory; DRAM module; specialty DRAM; automotive DRAM; industrial DRAM; micro circuits; micro integrated circuits; electronic circuits; semiconductor components; chips; computer memory; computer memory devices; Integrated circuits and integrated circuit cores for use in wireless communications and wireless communication equipment and apparatus and digital signal processors (DSP); Integrated circuit modules; Electronic integrated circuits; Decision circuits; Large scale integrated circuits; Circuits for heavy current; Cards with integrated circuits; Microcircuits; Very large scale integration (VLSI) semiconductor integrated circuits; Electric and electronic circuits; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Electronic components in the nature of semiconductors and integrated circuits; Wafers for integrated circuits; Integrated circuit cards and components; Flexible circuit boards; Dynamic random access memory (DRAM)
Design of integrated circuits; Design of computer hardware, integrated circuits, communications hardware and software and computer networks for others; Development of technologies for the fabrication of circuits for wireless communication, electronic data processing, consumer electronic, automotive electronics; Design for others of integrated circuits and integrated circuit cores for use in wireless communications and wireless communication equipment and apparatus and digital signal processors (DSP); Research, development, and design of various electronic products and semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Structure design for semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Testing and consulting of various electronic products and semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Quality inspection, testing and identification of semiconductor products, including known good die, known good die memory, dynamic random access memory, DRAM modules, integrated circuits, micro circuits, micro integrated circuits, electronic circuits, semiconductor, semiconductor components, semiconductor chips, computer hardware, computer memory, computer memory devices, and computer components; Research in the area of semiconductor processing technology; Design and development of automated controller systems, namely, temperature, humidity and electrical controllers; Development and implementation of software, hardware and technology solutions for the purpose of testing of electronic components and electronic systems; Development and implementation of software, hardware and technology solutions for the purpose of productization of electronic components and electronic systems
No 97169878
No Service Mark
No
No
No
No
No
No
No
No
No
| Status Date | Action Taken |
|---|---|
| 28th Apr 2022 | ABANDONMENT NOTICE E-MAILED - EXPRESS ABANDONMENT |
| 28th Apr 2022 | ABANDONMENT - EXPRESS MAILED |
| 27th Apr 2022 | TEAS EXPRESS ABANDONMENT RECEIVED |
| 16th Dec 2021 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM |
| 16th Dec 2021 | NEW APPLICATION ENTERED IN TRAM |
