no statement of use filed
on 29 Mar 2000
Last Applicant/ Owned by
P. O. Box 9329
Newark
DE
19714
Serial Number
75236343 filed on 04th Feb 1997
Registration Number
N/A
Filing Basis
1. intent to use
2. intent to use current
Disclaimer
NO DATA
dielectric material in sheet form for use in laminated electronic assemblies, namely, semiconductor chip packages, semiconductor package substrates, circuit boards and electronic circuit substrates
dielectric material in sheet form for use in laminated electronic assemblies, namely, semiconductor chip packages, semiconductor package substrates, circuit boards and electronic circuit substrates
No 75236343
No Service/Collective Mark
No TM.302.17
No
No
No
No
No
No
No
No
| Status Date | Action Taken |
|---|---|
| 09th Jun 2000 | ABANDONMENT - NO USE STATEMENT FILED |
| 28th Sep 1999 | NOA MAILED - SOU REQUIRED FROM APPLICANT |
| 12th Aug 1999 | OPPOSITION DISMISSED NO. 999999 |
| 12th Aug 1999 | OPPOSITION TERMINATED NO. 999999 |
| 25th Jun 1998 | OPPOSITION INSTITUTED NO. 999999 |
| 13th Apr 1998 | EXTENSION OF TIME TO OPPOSE RECEIVED |
| 10th Mar 1998 | PUBLISHED FOR OPPOSITION |
| 07th Feb 1998 | NOTICE OF PUBLICATION |
| 14th Jan 1998 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| 09th Jan 1998 | EXAMINER'S AMENDMENT MAILED |
