section 8
on 20 Apr 2002
Last Applicant/ Owned by
1-1, Chiryo-2, Nishibiwajima-cho
Nishikasugai-gun, Aichi-ken
JP
Serial Number
74178157 filed on 20th Jun 1991
Registration Number
1889070 registered on 11th Apr 1995
Correspondent Address
V.M. Creedon
Wenderoth, Lind & Ponack
Suite 700, Southern Building
805 Fifteenth Street, N.W.
Washington, DC 20005
Filing Basis
1. intent to use
2. use application currently
Disclaimer
NO DATA
lapping machines, polishing machines, and grinding machines, and abrasive and polishing pads, wheels and shaped solid blocks used as accessories therefor abrasives and polishing agents in the form of powders, pastes, slurries, colloids, and pellets for use with silicon wafers, semiconductor crystals, compound semiconductors, quartz crystals, prisms, lenses, glass, metal, plastics and ceramics
abrasives and polishing agents in the form of powders, pastes, slurries, colloids, and pellets for use with silicon wafers, semiconductor crystals, compound semiconductors, quartz crystals, prisms, lenses, glass, metal, plastics and ceramics
10th Dec 1993
10th Dec 1993
lapping machines, polishing machines, and grinding machines, and abrasive and polishing pads, wheels and shaped solid blocks used as accessories therefor
10th Dec 1993
10th Dec 1993
No 74178157
No Service/Collective Mark
No PJC-114
No
No
No
No
No
No
No
No
| Status Date | Action Taken |
|---|---|
| 20th Apr 2002 | CANCELLED SEC. 8 (6-YR) |
| 11th Apr 1995 | REGISTERED-PRINCIPAL REGISTER |
| 13th Dec 1994 | ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED |
| 16th Nov 1994 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| 19th May 1994 | ASSIGNED TO EXAMINER |
| 19th May 1994 | NON-FINAL ACTION MAILED |
| 28th Apr 1994 | ASSIGNED TO EXAMINER |
| 27th Apr 1994 | EXTENSION 3 GRANTED |
| 27th Apr 1994 | STATEMENT OF USE PROCESSING COMPLETE |
| 28th Mar 1994 | USE AMENDMENT FILED |
