failure to respond or late response
on 20 Dec 2022
Last Applicant/ Owned by
1-1, Osaki 2-chome, Shinagawa-ku
Tokyo
JP
141-6024
Serial Number
90735764 filed on 26th May 2021
Registration Number
N/A
Correspondent Address
LEIGH ANN LINDQUIST
Filing Basis
1. filed as use application
2. use application currently
Disclaimer
NO DATA
Non-metal gaskets for use in manufacture of liquid crystal and semi-conductor; electromagnetic interference shielding gaskets; non-metal packings, namely, packing materials having resistance to plasma and heat; packings made primarily of plastic and rubber; packings made primarily of plastic and rubber for use in manufacture of liquid crystal and semi-conductor; none of the above having adhesive cRead More
Non-metal gaskets for use in manufacture of liquid crystal and semi-conductor; electromagnetic interference shielding gaskets; non-metal packings, namely, packing materials having resistance to plasma and heat; packings made primarily of plastic and rubber; packings made primarily of plastic and rubber for use in manufacture of liquid crystal and semi-conductor; none of the above having adhesive characteristic
03rd May 2021
03rd May 2021
No 90735764
No Service/Collective Mark
No S25393
Yes
No
No
Yes
No
No
No
No
| Status Date | Action Taken |
|---|---|
| 20th Dec 2022 | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE |
| 20th Dec 2022 | ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND |
| 15th Jul 2022 | ASSIGNED TO EXAMINER |
| 07th Jun 2022 | FINAL REFUSAL WRITTEN |
| 07th Jun 2022 | FINAL REFUSAL E-MAILED |
| 07th Jun 2022 | NOTIFICATION OF FINAL REFUSAL EMAILED |
| 25th Apr 2022 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| 25th Apr 2022 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| 25th Apr 2022 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| 15th Feb 2022 | NON-FINAL ACTION WRITTEN |
