accepted and acknowledged
on 22 Oct 2021
Last Applicant/ Owned by
14-1, Sotokanda 4-Chome, Chiyoda-ku
Tokyo
JP
101-0021
Serial Number
86102546 filed on 26th Oct 2013
Registration Number
4786536 registered on 04th Aug 2015
Filing Basis
1. intent to use
2. use application currently
Disclaimer
"'POWER SINTERING PASTE'"
"'POWER SINTERING PASTE'" Binding agents in the form of paste made of silver powder or silver nanoparticle used in binding semiconductors and substrates of power devices The English translation of "DOWA" in the mark is "equally harmonized".
Binding agents in the form of paste made of silver powder or silver nanoparticle used in binding semiconductors and substrates of power devices
23rd Oct 2012
15th Jan 2013
No 86102546
No Service/Collective Mark
No 201518030546
No
No
No
No
No
No
No
No
Status Date | Action Taken |
---|---|
22nd Oct 2021 | REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK. |
22nd Oct 2021 | NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED |
21st Oct 2021 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
14th Jul 2021 | TEAS SECTION 8 & 15 RECEIVED |
04th Aug 2020 | COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED |
02th Oct 2015 | REVIEW OF CORRESPONDENCE COMPLETE - CERTIFICATE OF REG MAILED |
02th Oct 2015 | CASE ASSIGNED TO POST REGISTRATION PARALEGAL |
01st Oct 2015 | PAPER RECEIVED |
04th Aug 2015 | REGISTERED-PRINCIPAL REGISTER |
02th Jul 2015 | NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED |