BOND MULTIPLY BOOST Trademark Information

Smartiply, Inc.

Computer software and hardware for connecting, managing, and enabling communication among smartphones, tablets, and devices in a network; computing platform to enable communication of data and collaboration among Internet of Things (IoT) devices over a network; computer software and platform to enable collaboration among Internet of Things (IoT) devices connected in a fog network; software development kit (SDK) comprised of software developmen...

Development, design, implementation, and maintenance of software and computing platform solutions for connecting and managing smartphones, tablets, and devices in a network; development, design, implementation, and maintenance of software and computing platform solutions to enable communication and collaboration among smartphones, tablets, devices, and Internet of Things (IoT) devices in a fog network

This is a brand page for the BOND MULTIPLY BOOST trademark by Smartiply, Inc.  in Basking Ridge, NJ, 07920.

Write a review about a product or service associated with this BOND MULTIPLY BOOST trademark. Or, contact the owner Smartiply, Inc. of the BOND MULTIPLY BOOST trademark by filing a request to communicate with the Legal Correspondent for licensing, use, and/or questions related to the BOND MULTIPLY BOOST trademark.

On Thursday, January 14, 2016, a U.S. federal trademark registration was filed for BOND MULTIPLY BOOST by Smartiply, Inc., Basking Ridge, NJ 07920. The USPTO has given the BOND MULTIPLY BOOST trademark serial number of 86876177. The current federal status of this trademark filing is STATEMENT OF USE, REGISTRATION REVIEW COMPLETE. The correspondent listed for BOND MULTIPLY BOOST is WEI WEI JEANG of GRABLE MARTIN FULTON PLLC, 2709 DUBLIN ROAD, PLANO, TX 75094 . The BOND MULTIPLY BOOST trademark is filed in the category of Computer & Software Products & Electrical & Scientific Products , Computer & Software Services & Scientific Services . The description provided to the USPTO for BOND MULTIPLY BOOST is Computer software and hardware for connecting, managing, and enabling communication among smartphones, tablets, and devices in a network; computing platform to enable communication of data and collaboration among Internet of Things (IoT) devices over a network; computer software and platform to enable collaboration among Internet of Things (IoT) devices connected in a fog network; software development kit (SDK) comprised of software development tools to enable third parties to create computer software and platform to enable collaboration among Internet of Things (IoT) devices connected in a fog network.

Word mark: BOND MULTIPLY BOOST
Status/Status Date:
STATEMENT OF USE, REGISTRATION REVIEW COMPLETE
3/16/2018
Serial Number: 86876177
Filing Date: 1/14/2016
Registration Number: NOT AVAILABLE
Registration Date: NOT AVAILABLE
Goods and Services: Computer software and hardware for connecting, managing, and enabling communication among smartphones, tablets, and devices in a network; computing platform to enable communication of data and collaboration among Internet of Things (IoT) devices over a network; computer software and platform to enable collaboration among Internet of Things (IoT) devices connected in a fog network; software development kit (SDK) comprised of software development tools to enable third parties to create computer software and platform to enable collaboration among Internet of Things (IoT) devices connected in a fog network
Mark Description: The mark consists of the wording "BOND", "MULTIPLY" and "BOOST", with each word encompassed by a hexagon.
Type Of Mark: Service Mark
Published For Opposition Date: 6/7/2016
Last Applicant/Owner: Smartiply, Inc.
Basking Ridge, NJ 07920
Mark Drawing Code: Drawing/Design + Words
Design Search:
Plain single or multiple line polygons (Geometric figures and solids - Polygons (geometric figures with five or more sides)) see more design...
More than one polygon (Geometric figures and solids - Polygons (geometric figures with five or more sides)) see more design...
Register Type: Principal
Disclaimer: ("BOND")
Correspondent:
GRABLE MARTIN FULTON PLLC
2709 DUBLIN ROAD
PLANO, TX 75094

Use in Commerce Trademark - Applicant has provided proof of use of this mark in commerce to USPTO.

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Current Trademark Status:
3/16/2018
STATEMENT OF USE, REGISTRATION REVIEW COMPLETE
Correspondent Search:

WEI WEI JEANG is a correspondent of BOND MULTIPLY BOOST trademark.

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