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BOND LAB
Dead/Cancelled
CANCELLED - SECTION 8

section 8

on 17 Dec 2010

Last Applicant/ Owned by

P.O. BOX 1013

HUDSON

WI

54016

Serial Number

76058924 filed on 01st Jun 2000

Registration Number

2841869 registered on 11th May 2004

in the Supplemental Register

Correspondent Address

Anthony G. Eggink

Eggink & Eggink

Suite 3100

332 Minnesota Street

St. Paul MN 55101

Filing Basis

1. intent to use

2. use application currently

Disclaimer

"LAB"

BOND LAB

"LAB" Custom manufacture of adhesives Adhesive testing and adhesive process development

Classification Information


Class [040]
Treatment & Processing of Materials Services


Custom manufacture of adhesives


First Use Date in General

15th Nov 2001

First Use Date in Commerce

15th Nov 2001

Class [042]
Computer & Software Services & Scientific Services


Adhesive testing and adhesive process development


First Use Date in General

15th Nov 2001

First Use Date in Commerce

15th Nov 2001

Mark Details


Serial Number

No 76058924

Mark Type

No Service Mark

Attorney Docket Number

No BP06

44D Filed

No

44D Current

No

44E filed

No

44E Current

No

66A Filed

No

66A Current

No

Current Basis

No

No Basis

No

Legal History


Show more

Status DateAction Taken
17th Dec 2010CANCELLED SEC. 8 (6-YR)
04th May 2009ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
04th May 2009TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
11th May 2004REGISTERED-SUPPLEMENTAL REGISTER
19th Feb 2004USE AMENDMENT ACCEPTED
19th Feb 2004APPROVED FOR REGISTRATION SUPPLEMENTAL REGISTER
28th Jan 2004CASE FILE IN TICRS
17th Jun 2003FAX RECEIVED
17th Jun 2003CORRESPONDENCE RECEIVED IN LAW OFFICE
28th May 2003ACTION DENYING REQ FOR RECON MAILED