on 24 May 2022
Last Applicant/ Owned by
Taunton Road, Greenford
Middlesex
GB
UB68UQ
Serial Number
90710869 filed on 14th May 2021
Registration Number
6730014 registered on 24th May 2022
Correspondent Address
Sam Yip
IDEA INTELLECTUAL LIMITED
10/F-1, No.70-1
Section 1, Chengde Road, Datong District
Taipei City 103622 Taiwan
Filing Basis
1. use application currently
Disclaimer
NO DATA
Thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; Electrically insulating thermal interface materials and electrically conductive thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thRead More
Thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; Electrically insulating thermal interface materials and electrically conductive thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members
29th Jan 2007
25th Apr 2014
No 90710869
No Service/Collective Mark
No TM1343US17
No
No
No
No
No
No
No
No
| Status Date | Action Taken |
|---|---|
| 24th May 2022 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
| 24th May 2022 | REGISTERED-PRINCIPAL REGISTER |
| 01st Mar 2022 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| 01st Mar 2022 | PUBLISHED FOR OPPOSITION |
| 09th Feb 2022 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| 26th Jan 2022 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| 24th Jan 2022 | ASSIGNED TO EXAMINER |
| 30th Dec 2021 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| 30th Dec 2021 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| 30th Dec 2021 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
