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ADVANCED TECHNICAL CERAMICS COMPANY
Live/Registered
REGISTERED AND RENEWED

on 24 Mar 2016

Last Applicant/ Owned by

511 Manufacturers Road

Chattanooga

TN

37405

Serial Number

78527890 filed on 06th Dec 2004

Registration Number

3166888 registered on 31st Oct 2006

in the Supplemental Register

Correspondent Address

Nicole Rossi Townes

KNOBBE, MARTENS, OLSON & BEAR LLP

2040 Main Street, 14th Floor

IRVINE CA 92614-7216

Filing Basis

1. use application currently

Disclaimer

"CERAMICS COMPANY"

ADVANCED TECHNICAL CERAMICS COMPANY

Ceramic and metal electronic components, namely, single and multi-layer co-fire ceramic packages, ceramic packages, ceramic packaging, multi layer ceramics and brazed assemblies therefor all for micro electronic high reliability applications for use in combination with microchips, resistors and capacitors; ceramic chip scale packaging, namely, integrated circuit packages that contact pads instead Read More

Classification Information


Class [001]
Chemical Products


Ceramic compositions in the solid state for manufacture of alumina High Temperature Cofired Ceramic (HTCC) and Low Temperature Co-Fire Ceramic (LTCC); aluminum nitride (AIN) for use in the manufacture of ceramic electronic components; ceramic compositions in the solid state for manufacture of ceramic electronic components, namely, non-metal ceramic substrates


First Use Date in General

26th Mar 2004

First Use Date in Commerce

02th Apr 2004

Class [009]
Computer & Software Products & Electrical & Scientific Products


Ceramic and metal electronic components, namely, single and multi-layer co-fire ceramic packages, ceramic packages, ceramic packaging, multi layer ceramics and brazed assemblies therefor all for micro electronic high reliability applications for use in combination with microchips, resistors and capacitors; ceramic chip scale packaging, namely, integrated circuit packages that contact pads instead of pins or wires; ceramic pin grid arrays and ceramic ball grid arrays all in the nature of configurations for microprocessor sockets on computer motherboards; multi chip integrated circuit modules; feedthroughs, namely, ceramic co-fired conductors hermetically connecting two circuits on opposite sides of a metal housing; heat spreaders for removing heat from high power devices in a ceramic package; leadless ceramic chip carriers, namely, semiconductor chip housings; brazed metal electronic assemblies, namely, quad flat packs and dual in-line packages for use with integrated circuits


First Use Date in General

26th Mar 2004

First Use Date in Commerce

02th Apr 2004

Mark Details


Serial Number

No 78527890

Mark Type

No Service/Collective Mark

Attorney Docket Number

No ATCC.001T

44D Filed

No

44D Current

No

44E filed

No

44E Current

No

66A Filed

No

66A Current

No

Current Basis

No

No Basis

No

Legal History


Show more

Status DateAction Taken
24th Mar 2016REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
24th Mar 2016REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
24th Mar 2016NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
24th Mar 2016CASE ASSIGNED TO POST REGISTRATION PARALEGAL
18th Jan 2016TEAS SECTION 8 & 9 RECEIVED
31st Oct 2015COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
21st Nov 2011REGISTERED - SEC. 8 (6-YR) ACCEPTED
21st Nov 2011NOTICE OF ACCEPTANCE OF SEC. 8 - E-MAILED
16th Nov 2011CASE ASSIGNED TO POST REGISTRATION PARALEGAL
31st Oct 2011TEAS SECTION 8 RECEIVED