POWER-FORM Trademark Information

AOS Thermal Compounds, LLC

THERMAL HEAT SINK COMPOUNDS, NAMELY, THERMAL GREASE FOR USE IN MOUNTING TRANSISTORS, DIODES, RECTIFIER, RESISTORS, POWER SUPPLIES AND POWER CONVERTERS AND FOR USE IN A THERMAL JOINT FOR ANY ELECTRONIC APPARATUS WHERE EFFICIENT COOLING IS DESIRED

Perfect for these industries

Words that describe this mark

thermal   heat   sink   compounds       thermal   grease   use   mounting   transistors     diodes     rectifier     resistors     power   supplies   power   converters   use   thermal   joint   electronic  

This is a brand page for the POWER-FORM trademark by AOS Thermal Compounds, LLC  in Eatontown, NJ, 07724.

Write a review about a product or service associated with this POWER-FORM trademark. Or, contact the owner AOS Thermal Compounds, LLC of the POWER-FORM trademark by filing a request to communicate with the Legal Correspondent for licensing, use, and/or questions related to the POWER-FORM trademark.

On Monday, July 16, 2001, a U.S. federal trademark registration was filed for POWER-FORM by AOS Thermal Compounds, LLC, Eatontown, NJ 07724. The USPTO has given the POWER-FORM trademark serial number of 76285477. The current federal status of this trademark filing is CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE. The correspondent listed for POWER-FORM is William F. Herbert of Staas & Halsey LLP, Suite 700, 1201 New York Avenue, NW Washington DC 20005 . The POWER-FORM trademark is filed in the category of Lubricant and Fuel Products . The description provided to the USPTO for POWER-FORM is THERMAL HEAT SINK COMPOUNDS, NAMELY, THERMAL GREASE FOR USE IN MOUNTING TRANSISTORS, DIODES, RECTIFIER, RESISTORS, POWER SUPPLIES AND POWER CONVERTERS AND FOR USE IN A THERMAL JOINT FOR ANY ELECTRONIC APPARATUS WHERE EFFICIENT COOLING IS DESIRED.

Word mark: POWER-FORM
Status/Status Date:
CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE
4/24/2010
Serial Number: 76285477
Filing Date: 7/16/2001
Registration Number: 2765059
Registration Date: 9/16/2003
Goods and Services: THERMAL HEAT SINK COMPOUNDS, NAMELY, THERMAL GREASE FOR USE IN MOUNTING TRANSISTORS, DIODES, RECTIFIER, RESISTORS, POWER SUPPLIES AND POWER CONVERTERS AND FOR USE IN A THERMAL JOINT FOR ANY ELECTRONIC APPARATUS WHERE EFFICIENT COOLING IS DESIRED
Mark Description: NOT AVAILABLE
Type Of Mark: TradeMark
Published For Opposition Date: 8/13/2002
Last Applicant/Owner: AOS Thermal Compounds, LLC
Eatontown, NJ 07724
Mark Drawing Code: Typeset (Words/letter/Number)
Design Search: (NO DATA)
Register Type: Principal
Disclaimer: (NOT AVAILABLE)
Correspondent:
Staas & Halsey LLP
Suite 700
1201 New York Avenue, NW
Washington DC 20005

Use in Commerce Trademark - Applicant has provided proof of use of this mark in commerce to USPTO.

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Current Trademark Status:
4/24/2010
CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE
Correspondent Search:

William F. Herbert is a correspondent of POWER-FORM trademark.

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