MAXREL Trademark Information

ALPHA ASSEMBLY SOLUTIONS INC.

Die attach materials and adhesives, namely, metallic, and composite die attach materials and chemicals, chemical fluxes and adhesives used in light emitting diode and organic light emitting diode packaging and assembly, and power driver and control systems for light emitting diode and organic light emitting diode systems; light emitting diode and organic light emitting diode and power driver packaging materials, namely, chemical solder spheres...

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Words that describe this mark

die   attach   materials   adhesives       metallic     composite   die   attach   materials   chemicals     chemical   fluxes   adhesives   used   light   emitting   diode   organic   light   emitting   diode   packaging  

This is a brand page for the MAXREL trademark by ALPHA ASSEMBLY SOLUTIONS INC.  in SOMERSET, NJ, 08873.

Write a review about a product or service associated with this MAXREL trademark. Or, contact the owner ALPHA ASSEMBLY SOLUTIONS INC. of the MAXREL trademark by filing a request to communicate with the Legal Correspondent for licensing, use, and/or questions related to the MAXREL trademark.

On Friday, February 5, 2016, a U.S. federal trademark registration was filed for MAXREL by ALPHA ASSEMBLY SOLUTIONS INC., SOMERSET, NJ 08873. The USPTO has given the MAXREL trademark serial number of 86899372. The current federal status of this trademark filing is ABANDONED - EXPRESS. The correspondent listed for MAXREL is MIDGE M. HYMAN of Cowan Liebowitz & Latman P C, 114 West 47th Street, New York NY 10036-6710 . The MAXREL trademark is filed in the category of Chemical Products . The description provided to the USPTO for MAXREL is Die attach materials and adhesives, namely, metallic, and composite die attach materials and chemicals, chemical fluxes and adhesives used in light emitting diode and organic light emitting diode packaging and assembly, and power driver and control systems for light emitting diode and organic light emitting diode systems; light emitting diode and organic light emitting diode and power driver packaging materials, namely, chemical solder spheres used for chemical and metal based solder bumping, ball grid arrays and interconnect applications for light emitting diode and organic light emitting diode and related power driver and control system device packaging; wafer bumping pastes, hermetic sealing materials, and other metal and polymer-metal composite materials used in light emitting diode wafer bumping and used in hermetically sealing light emitting diode and organic light emitting diode products; electroplating and electroless plating chemicals, namely, copper, tin, nickel, and silver based chemistries including brighteners and levelers, and chemicals for plating on plastics.

Word mark: MAXREL
Status/Status Date:
ABANDONED - EXPRESS
11/22/2016
Serial Number: 86899372
Filing Date: 2/5/2016
Registration Number: NOT AVAILABLE
Registration Date: NOT AVAILABLE
Goods and Services: Die attach materials and adhesives, namely, metallic, and composite die attach materials and chemicals, chemical fluxes and adhesives used in light emitting diode and organic light emitting diode packaging and assembly, and power driver and control systems for light emitting diode and organic light emitting diode systems; light emitting diode and organic light emitting diode and power driver packaging materials, namely, chemical solder spheres used for chemical and metal based solder bumping, ball grid arrays and interconnect applications for light emitting diode and organic light emitting diode and related power driver and control system device packaging; wafer bumping pastes, hermetic sealing materials, and other metal and polymer-metal composite materials used in light emitting diode wafer bumping and used in hermetically sealing light emitting diode and organic light emitting diode products; electroplating and electroless plating chemicals, namely, copper, tin, nickel, and silver based chemistries including brighteners and levelers, and chemicals for plating on plastics
Mark Description: NOT AVAILABLE
Type Of Mark: TradeMark
Published For Opposition Date: N/A
Last Applicant/Owner: ALPHA ASSEMBLY SOLUTIONS INC.
SOMERSET, NJ 08873
Mark Drawing Code: Standard Character Mark
Design Search: (NO DATA)
Register Type: Principal
Disclaimer: (NOT AVAILABLE)
Correspondent:
Cowan Liebowitz & Latman P C
114 West 47th Street
New York NY 10036-6710

Intent to Use Trademark - Applicant has not submitted proof of use in commerce the the USPTO.

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Current Trademark Status:
11/22/2016
ABANDONED - EXPRESS
Correspondent Search:

MIDGE M. HYMAN is a correspondent of MAXREL trademark.

Current Overall Rating:
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