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KS
Live/Registered
REGISTERED AND RENEWED

on 17 Jun 2014

Last Applicant/ Owned by

1005 VIRGINIA DRIVE

FORT WASHINGTON

PA

19034

Serial Number

76328762 filed on 24th Oct 2001

Registration Number

2788019 registered on 02th Dec 2003

in the Principal Register

Correspondent Address

Christopher M. Spletzer, Sr.

1005 Virgina Ave

Fort Washington,PA 19034

Filing Basis

1. filed as use application

2. use application currently

Disclaimer

NO DATA

KS

Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging productRead More

Classification Information


Class [042]
Computer & Software Services & Scientific Services


Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging product design application support for the development, testing and assembly of new electrical circuits, all in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined information, which includes search engines and on-line web links to other web sites; design and fabrication services for others, namely, design and engineering of electrical printed circuit boards used in the semiconductor industry and the design and manufacturing of digital, analog and mix signal circuit boards; ] technical support services rendered in person, via telephone and via global computer network relating to the use of equipment used for the back-end assembly of semiconductors and installation of spare parts therefor


First Use Date in General

28th Feb 2001

First Use Date in Commerce

28th Feb 2001

Class [041]
Education and Entertainment Services


Customer training in the use of equipment for back-end assembly of semiconductors; [ on-line consulting and advisory services for said training ]


First Use Date in General

30th Apr 2000

First Use Date in Commerce

30th Apr 2000

Class [040]
Treatment & Processing of Materials Services


Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors; [ assembly services for others, namely, prototype building of mechanical components and printed circuit boards; and wafer bumping services for others, namely, semiconductor assembly services for placement of solder balls onto individual integrated electrical circuits ]


First Use Date in General

28th Feb 2001

First Use Date in Commerce

28th Feb 2001

Class [037]
Construction and Repair Services


Maintenance and refurbishment of equipment used in back-end assembly of semiconductors, namely, integrated circuit ball bonders, wedge bonders, manual wire bonders, [ automated dicing equipment, ] ribbon bonders, stud bumpers, [ wafer preparation equipment, testing equipment and ball attachment equipment; ] on-line consulting and advisory services for said equipment maintenance and refurbishment


First Use Date in General

30th Apr 2000

First Use Date in Commerce

30th Apr 2000

Class [035]
Advertising, Business & Retail Services


Providing on-line electronic commerce services, namely, on-line catalog for selection, [ ordering and payment ] of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing [ equipment and ] blades, factory automation products and services, [ electrical circuit substrates, ] manual wire bonding equipment, [ solder ball placement equipment, ] wafer bumping equipment, wafer bumping services, [ wafer preparation equipment, wafer test products and package test products, ] and on-line customer support services [ relating thereto ], namely, on-line supply, on-line logistics and support, on-line consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plants to enhance overall yields and reduce cycle times


First Use Date in General

30th Jun 2001

First Use Date in Commerce

30th Jun 2001

Class [009]
Computer & Software Products & Electrical & Scientific Products


Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materials, namely, substrates with copper inlay, [ polymer materials, namely, wire encapsulants applied over wire bonds to lock individual wires in place prior to molding, ] and bonding wires; bonder software, namely, software used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; [ dicing equipment, namely, electrical dicing equipment for sawing integrated circuit wafers and other hard materials into usable single components; ] factory automation software, namely, software designed for automated semiconductor material flow and gathering and collecting semiconductor assembly equipment data; [ wafer test products, namely, semiconductor probe cards that test the electrical functionality of an integrated circuit chip; package test products, namely, electrical sockets and contactors for testing the electrical functionality of a completed integrated circuit package; and electrical circuit substrates ]


First Use Date in General

30th Apr 2000

First Use Date in Commerce

30th Apr 2000

Class [008]
Hand Tool Products


Hand-operated wire bonding equipment, namely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductors, namely die collets, capillaries and wedge bonders


First Use Date in General

30th Apr 2000

First Use Date in Commerce

30th Apr 2000

Class [007]
Machinery Products


Dicing blades, namely, power-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipment, namely, semiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; [ solder ball placement equipment, namely, semiconductor assembly equipment used to place solder balls onto substrate material; ] wafer bumping equipment, namely, semiconductor assembly equipment for bonding stud bumps onto a silicon wafer; [ and wafer preparation equipment, namely, semiconductor assembly equipment for placing the wafer onto a plastic membrane and metal frame ]


First Use Date in General

30th Apr 2000

First Use Date in Commerce

30th Apr 2000

Mark Details


Serial Number

No 76328762

Mark Type

No Service Mark

Attorney Docket Number

No TM-002US

44D Filed

No

44D Current

No

44E filed

No

44E Current

No

66A Filed

No

66A Current

No

Current Basis

No

No Basis

No

Legal History


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Status DateAction Taken
13th Mar 2024TEAS SECTION 8 & 9 RECEIVED
02th Dec 2022COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
29th Jan 2018TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
29th Jan 2018ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
17th Jun 2014CASE ASSIGNED TO POST REGISTRATION PARALEGAL
17th Jun 2014REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
17th Jun 2014REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
17th Jun 2014NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
30th May 2014TEAS SECTION 8 & 9 RECEIVED
04th Jan 2010REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.