DTI DTI Trademark Information

DayShine Technology Inc.

components used in packaging integrated circuits, namely, an insulated wafer and substrate material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit

Words that describe this mark

components   used   packaging   integrated   circuits       insulated   wafer   substrate   material   fabricated   silicon   bismaleeimide   triazine   bt   resin   laminate   use   packaging   integrated   circuit   chip   plastic   ballgrid   array  

This is a brand page for the DTI DTI trademark by DayShine Technology Inc.  in Hsinchu Hsien, , .

Write a review about a product or service associated with this DTI DTI trademark. Or, contact the owner DayShine Technology Inc. of the DTI DTI trademark by filing a request to communicate with the Legal Correspondent for licensing, use, and/or questions related to the DTI DTI trademark.

On Thursday, September 3, 1998, a U.S. federal trademark registration was filed for DTI DTI. The USPTO has given the DTI DTI trademark serial number of 75547850. The current federal status of this trademark filing is CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE. The correspondent listed for DTI DTI is SHANNON T. VALE of ARNOLD, WHITE & DURKEE, P.O. BOX 4433, HOUSION, TEXAS 77210 . The DTI DTI trademark is filed in the category of Computer & Software Products & Electrical & Scientific Products . The description provided to the USPTO for DTI DTI is components used in packaging integrated circuits, namely, an insulated wafer and substrate material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit.

Word mark: DTI DTI
Status/Status Date:
CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE
3/28/2009
Serial Number: 75547850
Filing Date: 9/3/1998
Registration Number: 2585686
Registration Date: 6/25/2002
Goods and Services: components used in packaging integrated circuits, namely, an insulated wafer and substrate material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit
Mark Description: The mark consists of two stylizations of the letters "DTI".
Type Of Mark: TradeMark
Published For Opposition Date: 5/30/2000
Last Applicant/Owner: DayShine Technology Inc.
Hsinchu Hsien
Mark Drawing Code: Drawing with Words in Stylized form(75% Reduction of drawing size)
Design Search: (NO DATA)
Register Type: Principal
Disclaimer: (NOT AVAILABLE)
Correspondent:
ARNOLD, WHITE & DURKEE
P.O. BOX 4433
HOUSION, TEXAS 77210

Use in Commerce Trademark - Applicant has provided proof of use of this mark in commerce to USPTO.

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Current Trademark Status:
3/28/2009
CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE
Correspondent Search:

SHANNON T. VALE is a correspondent of DTI DTI trademark.

Current Overall Rating:
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