DTI DAYSHINE TECHNOLOGY INC. Trademark Information

DayShine Technology Inc.

components used in packaging integrated circuits, namely, an insulated wafer and substrata material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit

Words that describe this mark

components   used   packaging   integrated   circuits       insulated   wafer   substrata   material   fabricated   silicon   bismaleeimide   triazine   bt   resin   laminate   use   packaging   integrated   circuit   chip   plastic   ballgrid   array  

This is a brand page for the DTI DAYSHINE TECHNOLOGY INC. trademark by DayShine Technology Inc.  in Hsinchu Hsien, , .

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On Thursday, September 3, 1998, a U.S. federal trademark registration was filed for DTI DAYSHINE TECHNOLOGY INC.. The USPTO has given the DTI DAYSHINE TECHNOLOGY INC. trademark serial number of 75547340. The current federal status of this trademark filing is CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE. The correspondent listed for DTI DAYSHINE TECHNOLOGY INC. is SHANNON T. VALE of FULBRIGHT & JAWORSKI LLP, 600 CONGRESS AVENUE SUITE 2400, AUSTIN TEXAS 78701-3271 . The DTI DAYSHINE TECHNOLOGY INC. trademark is filed in the category of Computer & Software Products & Electrical & Scientific Products . The description provided to the USPTO for DTI DAYSHINE TECHNOLOGY INC. is components used in packaging integrated circuits, namely, an insulated wafer and substrata material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit.

Word mark: DTI DAYSHINE TECHNOLOGY INC.
Status/Status Date:
CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE
1/31/2009
Serial Number: 75547340
Filing Date: 9/3/1998
Registration Number: 2564021
Registration Date: 4/23/2002
Goods and Services: components used in packaging integrated circuits, namely, an insulated wafer and substrata material fabricated from silicon or Bismaleeimide Triazine (BT resin) laminate for use in packaging an integrated circuit chip into a plastic ball-grid array package which constitutes a part of the packaged integrated circuit
Mark Description: The mark consists in part of two stylizations of the letters DTI.
Type Of Mark: TradeMark
Published For Opposition Date: 8/15/2000
Last Applicant/Owner: DayShine Technology Inc.
Hsinchu Hsien
Mark Drawing Code: Drawing/Design + Words(50% Reduction of drawing size)
Design Search:
Geometric figures forming letters or numerals, including punctuation (Forms of writing - Figurative elements forming representations of letters or numerals, including punctuation) see more design...
Register Type: Principal
Disclaimer: ("TECHNOLOGY INC.")
Correspondent:
FULBRIGHT & JAWORSKI LLP
600 CONGRESS AVENUE SUITE 2400
AUSTIN TEXAS 78701-3271

Use in Commerce Trademark - Applicant has provided proof of use of this mark in commerce to USPTO.

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Current Trademark Status:
1/31/2009
CONTINUED USE NOT FILED WITHIN GRACE PERIOD, UN-REVIVABLE
Correspondent Search:

SHANNON T. VALE is a correspondent of DTI DAYSHINE TECHNOLOGY INC. trademark.

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