Solder Column Interposer

Solder Column Interposer European Union Trademark Information

Substrates for semi-conductors, glazed substrates for thermal printers, polyimide thin film multilayer substrates, integrated circuit packages for semi-conductors, chip size packages, crystal resonator SAW (Surface Acoustic Wave) filter packages, leadless chip carriers, interposers for semi-conductors, printed circuit boards, flexible printed boards, printed wiring boards, pin grid arrays, ball grid arrays; aluminium nitride products, namely, aluminium nitride substrates; printed circuits, printed wiring, cerdips (ceramic dual inline packages), multilayer printed boards.

Words that describe this mark

substrates   semiconductors     glazed   substrates   thermal   printers     polyimide   film   multilayer   substrates     integrated   circuit   packages   semiconductors     chip   size   packages     crystal   resonator   saw   surface   acoustic   wave   filter   packages     leadless   chip   carriers     interposers   semiconductors  
On Wednesday, March 31, 1999, an european community trademark registration was filed for Solder Column Interposer by NGK SPARK PLUG CO., LTD. ********, ******** **** **** ****. The OHIM has given the trademark application number of 001123900. The current status of this trademark filing is Application refused. The correspondent listed for Solder Column Interposer is HOFFMANN · EITLE PATENT- UND RECHTSANWÄLTE PARTMBB   of   Arabellastr. 30, München, DE 81925 . The Solder Column Interposer trademark is filed in the category of Computer & Software Products & Electrical & Scientific Products .
Word Mark: Solder Column Interposer
Status/
Status Date:
Application refused
Tuesday, October 17, 2000
Application Number: 001123900
Filing Date: Wednesday, March 31, 1999
Registration Date: Not Available
Type of Mark: Word
Kind of Mark: Individual
Mark Distinctiveness: Yes
Filing Language: Not Available
Secondary Language: Germany
Last Applicant/Owner:
NGK SPARK PLUG CO., LTD.
********
******** **** **** ****
Correspondent:

Classification Information

Class Code: 009
Class Description: Computer & Software Products & Electrical & Scientific Products
Goods & Services: Substrates for semi-conductors, glazed substrates for thermal printers, polyimide thin film multilayer substrates, integrated circuit packages for semi-conductors, chip size packages, crystal resonator SAW (Surface Acoustic Wave) filter packages, leadless chip carriers, interposers for semi-conductors, printed circuit boards, flexible printed boards, printed wiring boards, pin grid arrays, ball grid arrays; aluminium nitride products, namely, aluminium nitride substrates; printed circuits, printed wiring, cerdips (ceramic dual inline packages), multilayer printed boards.

Trademark Record History

Status Date: Record Status Description
5/13/2008 Proprietor - Change of name and address - Published

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