Solder Ball Interposer

Solder Ball Interposer European Union Trademark Information

Classification Information
Class Code: 009
Class Description: Computer & Software Products & Electrical & Scientific Products
Goods & Services: Substrates for semi-conductors, glazed substrates for thermal printers, polyimide thin film multilayer substrates, integrated circuit packages for semi-conductors, chip size packages, crystal resonator SAW (Surface Acoustic Wave) filter packages, leadless chip carriers, interposers for semi-conductors, printed circuit boards, flexible printed boards, printed wiring boards, pin grid arrays, ball grid arrays, aluminium nitride products, printed circuits, printed wiring, cerdips, multilayer printed boards.
Trademark Record History
Status Date: Record Status Description
5/13/2008 Proprietor - Change of name and address - Published
Word Mark: Solder Ball Interposer
Status / Status Date:
Application refused
Tuesday, January 29, 2002
Application Number: 001124304
Filing Date: Wednesday, March 31, 1999
Registration Date: Not Available
Type of Mark: Word
Kind of Mark: Individual
Mark Distinctiveness: Yes
Filing Language: Not Available
Secondary Language: Germany
Last Applicant/Owner:
Correspondent:
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