Publication Registration: |
Wednesday, August 10, 2022 |
Goods and Services Information
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Description:
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(1) - Treatment of materials for third parties, namely, the hermetical encapsulation of electro-technical, electronical and opto-electronical components
(2) - Hermetically sealed housings for the encapsulation of electro-technical, electronical and opto-electronical components
(3) - Scientific and technological services and research and design relating thereto in connection with the hermetical encapsulation of electro-technical, electronical and opto-electronical components
(4) - Hermetically sealed housings for the encapsulation of electro-technical, electronical and opto-electronical components, namely, automatic electronic control valves for regulating the flow of gases and liquids, automotive fuses, capacitors, circuit boards, electric double layer capacitors, electric switch plates, electric valve actuators, electrical circuits, electromagnetic switches, electronic conductors for fuel cells, electronic conductors for integrated circuits, electronic connectors for circuit boards, high intensity pulse lasers for nuclear fusion, humidity sensors, laser diode modules, lasers for photochemistry, lasers for surveying, lasers for use in industrial cutting applications, lasers for use in industrial welding applications, motion sensors, optical condensers, optical switches, organic light emitting diode display panels, power switches, pressure switches, printed circuit boards, printed circuits, semiconductor chips, semiconductor diodes, semiconductor integrated circuits, semiconductor transistors, semiconductor wafers, thermal sensors, timer switches, timing sensors, velocity sensors, wafers for integrated circuits
(5) - Hermetically sealed housings for the encapsulation of electro-technical, electronical and opto-electronical components
(6) - Treatment of materials for third parties, namely, the hermetical encapsulation of electro-technical, electronical and opto-electronical components
(7) - Scientific and technological services and research and design relating thereto in connection with the hermetical encapsulation of electro-technical, electronical and opto-electronical components
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