CEMI Canadian Trademark Information

Electronic materials of high purity metals, metal alloys and intermetallic compounds, namely: braising alloy preforms; die attach preforms; lids and lid seal preforms; soft solder preforms; heat sinks; bonding wires, bonding ribbons; evaporation supercharges; evaporation wires, sputtering targets, doping preforms, compound semiconductors of cadmium mercury telluride n or p type single crystal wafers, cadmium telluride single crystal wafers and bars, gallium antimonide single crystal wafers and polycrystaline slices and ingots, gallium arsenide semi-insulating single crystal wafers, indium antimonide n or p type, single crystal wafers and indium arsenide n type, single crystal wafers.

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Words that describe this mark

electronic materials high purity metals metal alloys intermetallic compounds braising alloy preforms die attach preforms lids lid seal preforms soft solder preforms heat sinks bonding wires bonding ribbons evaporation supercharges evaporation wires sputtering

Abandonment Notice! On Tuesday, December 7, 1999, status on the CEMI trademark changed to Registration cancelled. Apply Now for this name starting at $449!

CAUTION: Although Canada registration for this particular filing is inactive, the mark may still enjoy common law rights, or may have been applied for again in a separate application. Further research may be warranted to determine where this mark is truly abandoned in commerce.

On Friday, October 8, 1982, a canadian trademark registration was filed for CEMI by COMINCO AMERICAN INCORPORATED, *********, **********, ***** ****. The Canadian IP office has given the trademark application number of 493276. The current status of this trademark filing is Registration cancelled. The correspondent listed for CEMI is GOWLING WLG (CANADA) LLP of *********, **********, ***** **** The CEMI trademark is filed in the description of Electronic materials of high purity metals, metal alloys and intermetallic compounds, namely: braising alloy preforms; die attach preforms; lids and lid seal preforms; soft solder preforms; heat sinks; bonding wires, bonding ribbons; evaporation supercharges; evaporation wires, sputtering targets, doping preforms, compound semiconductors of cadmium mercury telluride n or p type single crystal wafers, cadmium telluride single crystal wafers and bars, gallium antimonide single crystal wafers and polycrystaline slices and ingots, gallium arsenide semi-insulating single crystal wafers, indium antimonide n or p type, single crystal wafers and indium arsenide n type, single crystal wafers. .

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Classification Information

Class Code:	001 - Chemical Products
Description:	Chemicals and adhesives
Class Code:	011 - Environmental Control Instrument Products (lighting, heating, cooling, cooking)
Description:	Appliances, lighting, heating, sanitary installations
Class Code:	012 - Vehicles and Products for locomotion by land, air or water
Description:	Vehicles
Class Code:	017 - Rubber Products
Description:	Rubber and plastic items
Class Code:	019 - Non-Metallic Building Material Products
Description:	Non-metallic construction materials
Class Code:	026 - Lace, Ribbons, Embroidery and Fancy Goods
Description:	Sewing and decorative items including fasteners
Class Code:	029 - Meats and Processed Food Products
Description:	Food - dairy, meats and processed foods
Class Code:	006 - Metal Products
Description:	Common metals, hardware
Class Code:	009 - Computer & Software Products & Electrical & Scientific Products
Description:	Electrical and scientific apparatus

Matter History Events

Status Date	Record Status Description
2000-07-04	National prosecution history entry - Agent Name Changed
2000-07-04	National prosecution history entry - Rep for Service Name Changed
1999-12-07	National prosecution history entry - Expunged - Failure to Renew
1999-05-12	National prosecution history entry - renewal notice sent
1984-04-19	Registration published - registered
1982-10-08	Application filed - filed

Word Mark:	CEMI
Current Status:	Registration cancelled DEAD Mark! Start a New Filing Request 12/7/1999
Application Number:	493276
Filing Date:	Friday, October 8, 1982
Filing Place:	Canada
Registration Date:	Thursday, April 19, 1984
Registration Number:	TMA289987
Register Type:	Primary
Type Of Mark:	Trademark
Mark Feature:	Word
Use In Commerce:	Yes
Last Applicant/Owner:	COMINCO AMERICAN INCORPORATED, ******* ****** * **
Correspondent:	GOWLING WLG (CANADA) LLP ******* ****** * **

Goods and Services Information
Description:	(1) - Electronic materials of high purity metals, metal alloys and intermetallic compounds, namely: braising alloy preforms; die attach preforms; lids and lid seal preforms; soft solder preforms; heat sinks; bonding wires, bonding ribbons; evaporation supercharges; evaporation wires, sputtering targets, doping preforms, compound semiconductors of cadmium mercury telluride n or p type single crystal wafers, cadmium telluride single crystal wafers and bars, gallium antimonide single crystal wafers and polycrystaline slices and ingots, gallium arsenide semi-insulating single crystal wafers, indium antimonide n or p type, single crystal wafers and indium arsenide n type, single crystal wafers.

Perfect for these industries

Words that describe this mark

a canadian trademark registration was filed for by . The Canadian IP office has given the trademark application number of . The current status of this trademark filing is . The correspondent listed for is The trademark is filed in the description of .

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2. Describe how your business or product is being used. Register your mark in 180+ countries.

What you get

1. Top Global Specialist - Credibility and Experience!

2. All processes will be performed in a timely manner. You will be informed periodically about the process.

What our customers say:

I wasn't too sure what to expect when taking up services, but the professionalism from the site to the customer service is the slickest I have ever experienced.

Camryn, Surrey, UK

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