TRANSCOMP Trademark Information

ASM Technology Singapore Pte Ltd

Molding machines, namely, combined transfer molding and compression molding machines; molding machine parts, namely, molds for use in the manufacture of semiconductor devices, integrated circuit products, semiconductor wafers and semiconductor wafer-related products, panels and panel-related products for integrated circuits and semiconductor devices, light-emitting diodes, light-emitting diode products, and lead frames; transfer molding machin...

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Words that describe this mark

molding   machines       combined   transfer   molding   compression   molding   machines   molding   machine   parts       molds   use   manufacture   semiconductor   devices     integrated   circuit   products     semiconductor  

This is a brand page for the TRANSCOMP trademark by ASM Technology Singapore Pte Ltd  in Singapore, , 768924.

Write a review about a product or service associated with this TRANSCOMP trademark. Or, contact the owner ASM Technology Singapore Pte Ltd of the TRANSCOMP trademark by filing a request to communicate with the Legal Correspondent for licensing, use, and/or questions related to the TRANSCOMP trademark.

Status Update! On Thursday, November 17, 2016, status on the TRANSCOMP trademark changed to USPTO PLACED APPLICATION ON HOLD PENDING OTHER ACTION.

On Tuesday, August 02, 2016, a U.S. federal trademark registration was filed for TRANSCOMP by ASM Technology Singapore Pte Ltd, Singapore 768924. The USPTO has given the TRANSCOMP trademark serial number of 87123944. The current federal status of this trademark filing is USPTO PLACED APPLICATION ON HOLD PENDING OTHER ACTION. The correspondent listed for TRANSCOMP is ROBERT C. FABER of OSTROLENK FABER LLP, 1180 AVENUE OF THE AMERICAS, 7TH FLOOR, NEW YORK, NY 10036 . The TRANSCOMP trademark is filed in the category of Machinery Products . The description provided to the USPTO for TRANSCOMP is Molding machines, namely, combined transfer molding and compression molding machines; molding machine parts, namely, molds for use in the manufacture of semiconductor devices, integrated circuit products, semiconductor wafers and semiconductor wafer-related products, panels and panel-related products for integrated circuits and semiconductor devices, light-emitting diodes, light-emitting diode products, and lead frames; transfer molding machines for use in the manufacture of semiconductor devices.

Word mark: TRANSCOMP
Status/Status Date:
USPTO PLACED APPLICATION ON HOLD PENDING OTHER ACTION
11/17/2016
Serial Number: 87123944
Filing Date: 8/2/2016
Foreign Filing Deadline: Thursday, February 2, 2017
 
Registration Number: NOT AVAILABLE
Registration Date: NOT AVAILABLE
Goods and Services: Molding machines, namely, combined transfer molding and compression molding machines; molding machine parts, namely, molds for use in the manufacture of semiconductor devices, integrated circuit products, semiconductor wafers and semiconductor wafer-related products, panels and panel-related products for integrated circuits and semiconductor devices, light-emitting diodes, light-emitting diode products, and lead frames; transfer molding machines for use in the manufacture of semiconductor devices
Mark Description: NOT AVAILABLE
Type Of Mark: TradeMark
Published For Opposition Date: N/A
Last Applicant/Owner: ASM Technology Singapore Pte Ltd
Singapore 768924
Mark Drawing Code: Standard Character Mark
Design Search: (NO DATA)
Register Type: Principal
Disclaimer: (NOT AVAILABLE)
Correspondent:
OSTROLENK FABER LLP
1180 AVENUE OF THE AMERICAS, 7TH FLOOR
NEW YORK, NY 10036

Use in Commerce Trademark - Applicant has provided proof of use of this mark in commerce to USPTO.

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Current Trademark Status:
11/17/2016
USPTO PLACED APPLICATION ON HOLD PENDING OTHER ACTION
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Correspondent Search:

ROBERT C. FABER is a correspondent of TRANSCOMP trademark.

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