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Design Feature:
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(1) Triangles with dark surfaces or parts of surfaces
(2) Several triangles, juxtaposed, joined or intersecting
(3) Triangles pointing downwards
(4) Triangular figures with one or more convex or concave sides
(5) Letters presenting a special form of writing
(6) Letters linked to or containing a figurative element -- Note: Letters representing a human being or a part of the human body, an animal or a part of an animal's body, a plant, a heavenly body, a natural phenomenon or an object are classified in division 27.3.
(7) Red, pink, orange
(8) Blue
(9) White, grey, silver
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Description:
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(1) - Semiconductors, integrated circuits, microchips, microprocessors, sensors, semiconductor packaging, and semiconductor parts; downloadable software for the operation of semiconductors, integrated circuits, microchips, microprocessors, sensors, semiconductor packaging, and semiconductor parts.
(2) - Semiconductors; integrated circuits; microchips; microprocessors; sensors, namely, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, and sensors for determining position; semiconductor parts, namely, semiconductor packaging; semiconductor parts, namely, semiconductor chips and semiconductor lead frames; downloadable software for the operation of semiconductors, integrated circuits, microchips, microprocessors, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position sensors, and semiconductor parts being semiconductor chips, semiconductor lead frames, and semiconductor packaging.
(3) - Custom manufacture of semiconductors, integrated circuits, microchips, microprocessors, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position, and semiconductor parts in the nature of semiconductor packaging.
(4) - Manufacture of semiconductors, integrated circuits, microchips, microprocessors, sensors, semiconductor packaging, semiconductor parts and development of software for the operation of the foregoing.
(5) - Design of semiconductors, integrated circuits, microchips, microprocessors, sensors, semiconductor packaging, semiconductor parts and development of software for the operation of the foregoing; temporary use of nondownloadable software for the operation of semiconductors, integrated circuits, microchips, microprocessors, sensors, semiconductor packaging, and semiconductor parts.
(6) - Design of semiconductors, integrated circuits, microchips, microprocessors, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position, and semiconductor parts in the nature of semiconductor packaging; development of software for the operation of semiconductors and semiconductor parts; providing temporary use of online non-downloadable software for the operation of semiconductors, integrated circuits, microchips, microprocessors, image sensors, image signal processors, ultrasonic sensors, photodetectors, touch sensors, ambient light sensors, temperature sensors, motion sensors, infrared sensors, sensors for determining position, and semiconductor parts in the nature of semiconductor packaging.
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