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ACCRETECH
Live/Registered
SECTION 8-ACCEPTED

accepted

on 11 Oct 2023

Last Applicant/ Owned by

Hachioji

Tokyo

JP

192-8515

Serial Number

87305279 filed on 18th Jan 2017

Registration Number

5284626 registered on 12th Sep 2017

in the Principal Register

Correspondent Address

Marie-Anne Mastrovito

WOMBLE BOND DICKINSON (US) LLP

950 3rd Avenue, Suite 2400

NEW YORK, NY, 10022

Filing Basis

1. filed as use application

2. use application currently

Disclaimer

NO DATA

ACCRETECH

Chemical machines, namely, semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machines; Semiconductor manufacturing equipment, namely, wire (( slicing machines, wafer slicing machines, slicing machines for non-silicon wafers, )) sliced wafer carbon demounting and cleaning machines, wafer edge grinding machines, dicing machines, and chemical mechanical planarizers and maRead More

Classification Information


Class [009]
Computer & Software Products & Electrical & Scientific Products


Precision measuring machines, namely, non-contact flatness measuring machines, laser interference length measuring sensors, optical fiber laser interferometer measuring machines, three-dimensional measuring machines, coordinate measuring machines; Data processing machines for use in processing coordinate measuring data; Computer controlled discrete device testers; Automatic die selector, namely, computerized equipment for testing semiconductors and for selection of dies for semiconductor manufacture; Electric or magnetic measuring machines and instruments, namely, electric current or voltage detectors, magnetic measuring apparatus in the nature of magnetic sensors, capacity measures; Optical instruments, namely, microscopes; (( Electronic machines and instruments and their parts and fittings, namely, ultrasonic depth sounders ))


First Use Date in General

31st Mar 2010

First Use Date in Commerce

31st Mar 2010

Class [007]
Machinery Products


Chemical machines, namely, semiconductor wafer drying machines, semiconductor wafer scrubbing and washing machines; Semiconductor manufacturing equipment, namely, wire (( slicing machines, wafer slicing machines, slicing machines for non-silicon wafers, )) sliced wafer carbon demounting and cleaning machines, wafer edge grinding machines, dicing machines, and chemical mechanical planarizers and machine parts therefor; (( Automatic distribution vending machines ))


First Use Date in General

31st Mar 2010

First Use Date in Commerce

31st Mar 2010

Mark Details


Serial Number

No 87305279

Mark Type

No Service/Collective Mark

Attorney Docket Number

No 115805.01680

44D Filed

No

44D Current

No

44E filed

No

44E Current

No

66A Filed

No

66A Current

No

Current Basis

No

No Basis

No

Legal History


Show more

Status DateAction Taken
11th Oct 2023REGISTERED - SEC. 8 (6-YR) ACCEPTED
11th Oct 2023REGISTERED - SEC. 15 ACKNOWLEDGED
10th Oct 2023CASE ASSIGNED TO POST REGISTRATION PARALEGAL
12th Sep 2023TEAS SECTION 8 RECEIVED
12th Sep 2023TEAS SECTION 15 RECEIVED
12th Sep 2022COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED
12th Sep 2017REGISTERED-PRINCIPAL REGISTER
27th Jun 2017PUBLISHED FOR OPPOSITION
27th Jun 2017OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
07th Jun 2017NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED